vault backup: 2025-03-25 09:29:47
Affected files: 00. Inbox/CPO.md 00. Inbox/Stock Info.md 00. Inbox/TSMC.md 00. Inbox/波若威.md 00. Inbox/矽品.md 00. Inbox/鴻海.md attachments/Pasted image 20250322142706.png attachments/Pasted image 20250322142814.png attachments/Pasted image 20250322142819.png attachments/Pasted image 20250322142857.png
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00. Inbox/CPO.md
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00. Inbox/CPO.md
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---
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tags:
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aliases:
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date: 2025-03-22
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time: 14:25:33
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description:
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---
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線路是電訊號,仍有著訊號耗損以及熱量問題。
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隨著AI與高性能運算帶來的算力
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資料傳輸的需求大幅提升
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1. 傳輸速度不夠快
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2. 有著散熱與能源耗損的問題
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矽光子是用光來傳輸,正好可以解決以上的兩大問題。
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是種製造晶片的技術,不過是光學的晶片
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![[Pasted image 20250322142706.png]]
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光電模組:
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- 光接收器
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- 光波導
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- 光調變器
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- 電流電壓放大器
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- 驅動IC
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- 交換器
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![[Pasted image 20250322142814.png]]
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![[Pasted image 20250322142819.png]]
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為了減少電訊號和高速運算的的損失,業界將矽光元件改到接近伺服器交換器週邊的位置,進一步縮短電流的距離,讓原先的插拔式模組僅剩光纖的部分。
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這個作法即為 (CPO, Co-Packaged Optics)技術,就是將EIC(電子積體電路)與PIC(光子積體電路)共同裝在同個載板,形成模組與晶片的共同封裝,進而取代光收發模組,讓光引擎更加地靠近CPU/GPU,縮短電的傳輸路徑,減少傳輸耗損和訊號的延遲。
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# CPO概念股
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![[Pasted image 20250322142857.png]]
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# 參考來源
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